Bondexpo – trend-setting industry meeting point for bonding technology

Bondexpo

Bondexpo – trend-setting industry meeting point for bonding technology

Stuttgart | 08.10.2012

This year the Bondexpo is taking place for the sixth time. It thus impressively documents the necessity of looking beyond the horizon in order to be able to present the production and assembly technology process kettles without gaps.

Around 122 exhibitors will present themselves at Bondexpo 2012 in Hall 7 of Messe Stuttgart and demonstrate that the process links between manufacturers and suppliers of adhesive, insulation, foaming, sealing and casting materials and application equipment, as well as handling in the respective application, are becoming increasingly close.

Bondexpo is thus becoming more and more important, especially since the subject of joining and joining new materials now and in the future represents a real “bonding technology” challenge.

After all, lightweight construction is not only an issue in vehicles, but also in apparatus and equipment. In future materials and material combinations as well as hybrid solutions, ratio and resource potentials can be found that can only be realized by using new adhesives. The 6th Bondexpo conveys the development status and know-how between research and development as well as application and use.

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