Thermipad® TP 22840: High-performance gap filler without silicone for sensitive electronics
Thermipad® TP 22840 is a high-performance, silicone-free thermal pad with low compression force. It was specially developed for applications where sensitive electronic or optical components need to be protected from mechanical stress. Thanks to its excellent thermal conductivity of 7,8 W / mK and the high electrical insulation, TP 22840 is ideal for demanding applications – completely without silicone.
Silicone-free gap filler for reliable heat dissipation
The silicone-free gap filler material Its particularly low thermal resistance makes it ideal for efficient heat dissipation in sensitive systems. Its low hardness and compression force enable gentle integration into systems with sensitive components. Thermipad® TP 22840 complies with Flame retardant class UL94 V-0 and offers maximum safety during operation.
Areas of application of Thermipad® TP 22840:
- Datacom systems
- Automotive electronics
- telecommunications systems
- Optical modules
- Industrial electronics
Technical highlights:
- Heat conductivity: 10,0 W / mK
- Working temperature range: -65 ° C to +125 ° C
- Thermal resistance (1,5mm, 30 PSI): 0,047 °C in²/W
- Dielectric breakdown voltage: 7,5kV/mm
- Volume resistance: 10^14 Ω
- Hardness (Shore 00): 40/8 at 1–5 mm
- Available thicknesses: 0,5 mm to 5 mm (in 0,5 mm increments)
- Color: Grey
Special shapes and individual cuts are available on request.
Why Thermipad® TP 22840?
If you are a silicone-free thermal pad with high thermal conductivity If you're looking for a material that reliably protects even sensitive electronic components, Thermipad® TP 22840 is the ideal solution. It combines thermal performance with mechanical softness and offers versatile applications in the modern electronics industry.
