Bergquist Thermal Interface Materials

By Lars Tech News EN mountain quist, Bergquist Thermal Interface Materials, Bond ply, gap fillers, gap pads, gap pad, Henkel, Hi Flow, LIQUI FORM products, microTIMs, phase change materials, SIL PADs, Sil Pad 0 Comments

Bergquist thermal interface materials

For over 50 years, Bergquist branded products have been the most trusted thermal management materials in the world. Multi-award-winning formulations in various media provide the necessary heat dissipation for applications in numerous markets, including automotive, consumer, telecom/datacom, energy and industrial automation, computing, communications and many more.

As electronic systems integrate more and more features into more sophisticated, complex designs and smaller dimensions, efficient thermal control is required to maximize performance and limit thermal failures.

Henkel's thermal management materials from Bergquist, including gap pads, gap filler, SIL PADs, phase change materials, microTIMs, LIQUI FORM products and thermal adhesives, meet today's toughest thermal management challenges.

In all market sectors and applications, higher performance, larger functions, smaller footprints and higher power densities require more effective heat dissipation solutions. Whether it's car batteries, motor drives and power electronics or optical modules in modern hyperscale data centers - thermal control is crucial for optimal, reliable operation.

When it comes to thermal interface materials and heat control, Bergquist is one of the most trusted brands out there.

Get to know the broad portfolio and find the right solution for your application. We manufacture ready-to-install components from Bergquist materials stampings, tapes and moldings.

BERGQUIST SIL PAD

There are two types of Sil Pads:

Electrically insulating thin heat-conducting foils and
non-electrically insulating thin heat-conducting foils

BERGQUIST SIL PAD: Electrically insulating thin pads

The thermally conductive insulating pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, are cleaner to work with than thermal pastes and are extremely inexpensive.

BERGQUIST SIL PAD: Non-electrically insulating thin pads

These materials are designed for applications that require maximum heat transfer but do not require electrical insulation. This makes SIL PAD the ideal thermal interface material to replace thermal paste.

Stamped parts from SIL PAD

We manufacture stampings and tapes from Silpad materials.

We supply the following SIL-PAD materials:

Sil-Pad 1100ST (Soft Tack)
Sil Pad 1200
Sil-Pad 1500ST (Soft Tack)
Sil Pad 2000
Sil Pad 400
Sil Pad 800
Sil Pad 900S
Sil Pad 980
Sil Pad A1500
Sil Pad A2000
Sil Pad K-10
Sil Pad K-4
Sil Pad K-6

BERGQUIST BOND-PLY adhesive tapes

BOND-PLY adhesive tapes are equipped with pressure-sensitive adhesives or can be laminated. They are thermally conductive and at the same time electrically insulating. BOND-PLY enables the thermal and mechanical connection of components with different coefficients of expansion.

We supply the following BOND-PLY products:

Bond Ply 100
Bond Ply 400
Bond ply 660P
Bond Ply 800
Bond Ply LMS-HD

Bond-Ply tape stampings

We manufacture stamped parts and tapes from BOND-PLY adhesive tapes.

BERGQUIST gap filler

GAP FILLER is supplied as a one or two component, room or high temperature curing system. The result is a soft, thermally conductive form-in-place elastomer that is ideal for bonding electronic components on circuit boards to an adjacent metal case or heatsink. Since gap filler is dosed and wetted in a liquid state, the material hardly puts any stress on the components during the assembly process.

We supply the following gap fillers:

Gap filler 1000
Gap filler 1000SR
Gap filler 1100SF
Gap filler 1400SL
Gap filler 1500
Gap filler 1500LV
Gap filler 2000
Gap filler 3500LV
Gap filler 3500S35
Gap filler 4000

BERGQUIST GAP PADs

GAP PADs enable effective heat conduction and compensate for uneven surfaces, air gaps and surface roughness between heat sinks and electronic components. They offer a high degree of conformity to reduce contact resistance. GAP PADs reduce stress on electrical connections, dampen vibration, and are compatible with automated dispensing systems.

We supply the following gap pads:

Gap Pad 1000HD
Gap Pad 1000SF
Gap pad 1450
Gap pad 1500
Gap Pad 1500R
Gap Pad 1500S30
Gap Pad 2000S40
Gap Pad 2200SF
Gap Pad 2202SF
Gap Pad 2500S20
Gap Pad 3000S30
Gap Pad 3004SF
Gap Pad 3500ULM
Gap Pad 5000S35
Gap Pad A2000
Gap Pad A3000
Gap pad EMI 1.0
Gap Pad HC 3.0
Gap Pad HC 5.0
GapPad HC1000
Gap Pad VO
Gap Pad VO Soft
Gap Pad VO Ultra Soft
Gap Pad VO Ultra Soft Black

Finished parts from GAP pads

We process GAP pads into ready-to-install parts on our plotters and punching machines. These can be delivered individually or on a roll.

BERGQUIST HI-FLOW pads

HI-FLOW phase change materials are an optimal replacement for thermal paste as a thermal interface between a CPU or power device and a heatsink. The material changes from a solid to a viscous liquid at certain phase change temperatures to ensure complete wetting.

We supply the following Hi-Flow products: