Bergquist SIL PAD

BERGQUIST® SILPAD TSP Q2500

Bergquist SIL PAD

Bergquist SIL PAD Properties and advantages of the SIL-PAD materials

SIL PADs are electrically and non-electrically insulating thermal materials. They offer a clean and efficient alternative to mica, ceramic or thermal paste for a wide range of electronic applications. They combine a robust carrier material such as glass fiber and adaptable silicone rubber.

The SIL PAD family includes dozens of products, each with its own structure, characteristics and performance, including:

  • Proven silicone rubber binders
  • Carrier made of glass fiber, dielectric film or polyester film
  • Special fillers to achieve specific performance characteristics
  • Flexible and adaptable
  • Reinforcements that prevent cutting through
  • Different thicknesses
  • Wide range of thermal conductivities and dielectric strengths

There are two types of Sil Pads:

1. Electrically insulating thin thermally conductive foils and

2. Non-electrically insulating thin heat-conducting foils

BERGQUIST SIL PAD: Electrically insulating thin pads

The thermally conductive insulating pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, are cleaner to work with than thermal pastes and are extremely inexpensive.

BERGQUIST SIL PAD: Non-electrically insulating thin pads

These materials are designed for applications that require maximum heat transfer but do not require electrical insulation. This makes SIL PAD the ideal thermal interface material to replace thermal paste.

Stamped parts from SIL PAD

We manufacture stampings and tapes from Silpad materials.

We supply the following SIL-PAD materials:

  • Sil-Pad 1100ST (Soft Tack)
  • Sil Pad 1200
  • Sil-Pad 1500ST (Soft Tack)
  • Sil Pad 2000
  • Sil Pad 400
  • Sil Pad 800
  • Sil Pad 900S
  • Sil Pad 980
  • Sil Pad A1500
  • Sil Pad A2000
  • Sil Pad K-10
  • Sil Pad K-4
  • Sil Pad K-6

In our article "Gap filler vs gap pad“ Let’s go into the differences between the two materials.

The SIL PAD® products are now part of the thermal management portfolio of Henkel and are used worldwide in electronic applications. Through Henkel's acquisition of the former Bergquist product families, users benefit from continuous development of the thermal interface materials and high international availability. Dr. Dietrich Müller GmbH supplies various Henkel SIL PAD® variants for applications in power electronics, power supply technology, electromobility, and industrial electronics.

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