Bergquist TGP 40000SF 40W/mK Silicone Free GAP PAD® from Henkel

BERGQUIST® SILPAD TSP Q2500

Bergquist TGP 40000SF 40W/mK Silicone Free GAP PAD® from Henkel

Dr. Dietrich Müller GmbH is pleased to announce a significant expansion of its thermal management solution offering: the Bergquist TGP 40000SF 40W/mK Silicone Free GAP PAD® from Henkel. This state-of-the-art material offers unprecedented thermal conductivity and meets the increasing demands for silicone-free materials in a variety of demanding applications.

Outstanding features for maximum efficiency

Henkel's Bergquist TGP 40000SF GAP PAD® sets new standards with an exceptional thermal conductivity of 40W/mK. Thanks to the special orientation filler technology, it offers excellent thermal performance at a peak pressure of 56psi. This technology ensures effective heat dissipation and easy handling, while offering a lower density and lighter layer thickness compared to conventional thermal interface materials (TIMs).

A key benefit of the TGP 40000SF GAP PAD is its silicone-free construction. This means there is no silicone outgassing or polymer migration, which is particularly important in sensitive applications where purity and material stability are essential. This material is therefore an ideal solution for applications where the highest thermal efficiency and minimal material migration are required.

Tailor-made precision parts from Dr. Dietrich Müller GmbH

As a processor and specialist for customer-specific precision parts, Dr. Dietrich Müller GmbH offers tailor-made solutions based on the high-quality GAP PAD from Henkel. We manufacture individual cuts and precision parts that are tailored exactly to the needs and specifications of our customers. Our expertise and our modern manufacturing techniques guarantee the highest quality and precision in every project.

Our services include customizing the material to the specific dimensions and shapes needed in different applications. This ensures that our customers receive the best solutions for their specific thermal management needs. The precision and quality of our products are the result of years of experience and state-of-the-art manufacturing technologies that we use in every step of the production process.

Various uses

The versatile applications of the Bergquist TGP 40000SF GAP PAD include:

  • Telecommunications: Ideal for use in 5G networks, data centers, switches, routers and optical transceivers. With the rapid development of 5G technology, powerful thermal management solutions are essential. The TGP 40000SF GAP PAD® ensures efficient heat dissipation in high frequency components used in data centers, switches and routers.
  • Automotive industry: Perfect for modules such as power converters and engine controls in vehicles. In modern vehicles, which increasingly rely on electronic controls and power modules, the GAP PAD® offers a reliable solution to prevent overheating and ensure the longevity and performance of the systems.
  • Aerospace: Provides reliable thermal management solutions for aerospace modules. Aerospace requires materials that can withstand extreme conditions. The silicone-free GAP PAD® ensures high thermal efficiency and reliability without the risk of material outgassing.
  • LEDs and lasers: Improves heat dissipation, resulting in longer lifetime and higher efficiency of the components. For applications in lighting and laser technology, where high performance and low heat generation are critical, the GAP PAD® offers an excellent solution for heat dissipation, significantly improving the efficiency and lifetime of the LEDs and lasers.

This versatility makes the GAP PAD® the ideal choice for a wide range of applications where thermal efficiency and material purity are critical.

Technical specifications in detail

  • Thermal conductivity: Outstanding 40W/mK, the highest in its class
  • Hardness: 85 Shore 00 according to ASTM D2240
  • density: 1.7g/cc, resulting in a lightweight and easy to handle material
  • Peak load: 56psi at 10% elongation, shows the resilience and flexibility of the material
  • Available sizes: Practical dimensions of 101,6 x 152,4 mm (4″ x 6″) and 152,4 x 152,4 mm (6″ x 6″)
  • Thick: Various thickness options from 0,508 mm (20 mils), 1,016 mm (40 mils), 1,524 mm (60 mils), 2,032 mm (80 mils), 2,54 mm (100 mils) to 3,175 mm (125 mils) to meet different requirements
  • operating temperature range: -40°C to +150°C, which allows a wide range of applications

Specific benefits and application scenarios

The Bergquist TGP 40000SF GAP PAD® offers numerous advantages that make it an ideal solution for various industrial applications:

  • Telecommunications and 5G networks: With the rapid development of 5G technology, powerful thermal management solutions are essential. The TGP 40000SF GAP PAD® ensures efficient heat dissipation in high frequency components used in data centers, switches and routers. The silicone-free construction prevents silicone migration and ensures reliable performance in highly sensitive environments.
  • Automotive sector: In modern vehicles that increasingly rely on electronic controls and power modules, the GAP PAD® offers a reliable solution to prevent overheating and ensure the longevity and performance of the systems. The high thermal conductivity and mechanical stability make it ideal for applications in power electronics, engine controls and other critical components.
  • Aerospace: Aerospace requires materials that can withstand extreme conditions. The silicone-free GAP PAD® ensures high thermal efficiency and reliability without the risk of material outgassing. This is particularly important in applications where the highest reliability and durability are required, such as in satellites, avionics and other critical systems.
  • LEDs and lasers: For applications in lighting and laser technology where high performance and low heat generation are critical, the GAP PAD® offers an excellent solution for heat dissipation, significantly improving the efficiency and lifetime of LEDs and lasers. The silicone-free construction prevents outgassing and ensures consistent and reliable performance over the entire lifetime of the components.
  • Electronic devices and data storage: The GAP PAD® is also ideal for electronics and data storage applications, including ASICs, DSPs, memory devices and optical transceivers. Its high thermal conductivity and ability to conform to irregular surfaces make it an ideal solution for cooling high-performance components and ensuring reliable and long-lasting performance.

Customized solutions for special requirements

Dr. Dietrich Müller GmbH is proud to offer its customers tailor-made solutions that are precisely tailored to their specific requirements and specifications. Our ability to machine Henkel's Bergquist TGP 40000SF GAP PAD® into precisely cut parts allows us to offer solutions that are perfectly tailored to our customers' requirements.

Our services include not only cutting the material to the required dimensions, but also designing and manufacturing custom shapes and designs to meet our customers' specific requirements and applications. We work closely with our customers to ensure that we can deliver the best solutions for their specific thermal management needs.

Quality and Reliability

Quality and reliability are the cornerstones of our business philosophy. Dr. Dietrich Müller GmbH uses the latest manufacturing technologies and strict quality control procedures to ensure that each product meets the highest standards. Our customers can be confident that they will receive products of the highest quality that are reliable and perform well.

Our years of experience and commitment to excellence have made us a trusted partner for companies across a wide range of industries. We pride ourselves on providing innovative and reliable solutions that meet our customers' highest demands.

A must for modern applications

The Bergquist TGP 40000SF 40W/mK Silicone Free GAP PAD® from Henkel, further processed and precisely cut by Dr. Dietrich Müller GmbH, is the ideal solution for engineers and developers who require the highest thermal performance with minimal material usage and without the risks of silicone fumes. With its outstanding thermal conductivity and robust, silicone-free construction, this GAP PAD® is an excellent choice for highly specialized and demanding applications.

For more information and to order, please visit the Dr. Dietrich Müller GmbH website or contact our sales team. We are happy to help you select the best solution for your specific requirements. Our team of experts is ready to assist you in identifying and implementing the best thermal management solutions for your specific applications.

Our comprehensive services and commitment to quality and reliability make Dr. Dietrich Müller GmbH your ideal partner for all your thermal management needs. Let us help you find the best possible solutions to your challenges and make your projects a success.

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