Bondexpo - future-oriented industry meeting point for bonding technology
Stuttgart | 08.10.2012/XNUMX/XNUMX
This year the Bondexpo takes place for the sixth time. It impressively documents the need to think outside the box in order to be able to seamlessly present the manufacturing and assembly technology of process boilers.
Around 122 exhibitors will be present at Bondexpo 2012 in Hall 7 of the Messe Stuttgart and show that the process links between manufacturers and suppliers of adhesive, insulating, foaming, sealing and potting materials and application devices as well as handling in the respective application are becoming ever closer will.
This means that Bondexpo is becoming more and more important, especially since the topic of joining and joining new materials is a real "bonding technology" challenge now and in the future.
After all, lightweight construction is not only an issue for vehicles, but also for apparatus and equipment. In future materials and material combinations as well as hybrid solutions, there are ratio and resource potentials that can only be realized through the use of new adhesives. The 6th Bondexpo conveys the state of development and know-how between research and development as well as application and use.
