Bondexpo – International trade fair for bonding technology
The Bondexpo is an international trade fair for bonding technology that takes place in Stuttgart.
Since it was founded in 2007, the trade fair has established itself as a global industry and user meeting place. It represents the entire process chain from joining and connecting by gluing, potting, sealing and foaming and offers solutions for practical applications and future challenges in the industry.
The use of new adhesives in particular is becoming increasingly important in lightweight construction, which extends not only to vehicles but also to apparatus and equipment. In addition, Bondexpo acts as a link between research and development as well as use and application. It shows new future paths in the areas of bonding, insulating, foaming, sealing and potting technology, which are presented in a production-related context through the combination of Bondexpo and Motek, the world's leading trade fair for production and assembly automation.
Because adhesive, potting, sealing and foaming processes in particular are essential components for highly automated processing in handling and robot systems. The trade fair is accompanied by an exhibitor forum in which experts address visitors and exhibitors with a presentation on current topics and products in adhesive technology. The Bondexpo has also established itself as an information and knowledge platform and is therefore an indispensable event in the industry.
The Bondexpo will take place over 4 days from Tuesday, October 04th to Friday, October 07th, 2022 in Stuttgart.
