New thermal management material made of polyimide resin
Dr. Dietrich Müller GmbH, a leading supplier of electrical insulation materials, thermal interface materials, gaskets, and technical films, has expanded its product range with a polyimide paper that sets new standards. Polyimides (PI) are high-performance plastics and are even used in aerospace. Polyimide paper finds diverse applications in electrical engineering and electronics due to its heat resistance, low outgassing, radiation resistance, and insulating properties. The new thermal management material offers several advantages, such as high heat resistance, light weight, and the typical properties of polyimide paper.
Properties of polyamide paper
The following nine properties of polyimide paper should be known to developers when considering its use:
- in discs available in various diameters
- Density: 0,2 g/cm³
- Thermal conductivity: 0,03 W/mK
- Air permeability: 200 cc/m²/sec
- Tensile strength: 15 MPa
- Elongation: 2%
- Elastic modulus: 0,8 GPa
- Coefficient of thermal expansion: 30 ppm/°C
- Breakdown voltage 15 kV/mm
The material has the following outgassing data:
- Total mass loss (TML) in %: 0,705 ±0,015
- Collected volatile condensable substances (CVCM) in %: 0,001 ±0,000
- Water vapor recovery (WVR) in %: 0,568 ±0,008
Figures 1 and 2 below illustrate the thermal conductivity and the thermogravimetric analysis:
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| Fig. 1: Thermal conductivity in W/m*K | Fig. 2: Thermogravimetric Analysis |
Polyimide paper in various configurations
Polyimide paper can be manufactured in various configurations. The material can be combined with different additional layers, such as polyimide film, aluminum, or graphite. Multilayer arrangements and 3D mold construction are also possible. Table 1 below illustrates the various configuration options.
| The Brand
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Features
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| Heat barrier tape |
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Polyimide paper does not contain silicon dioxide powder to enable an adhesive coating. |
| PI film lamination |
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Thermal barrier material. Waterproof, increased tear resistance, electrical insulation. |
| Aluminum vapor deposition |
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Radiant heat & conductive thermal barrier |
| Graphite lamination |
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Heat spreading and heat barrier to increase heat dissipation efficiency |
| Multilayer (<1mm thick) |
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Various polyimide structures |
| 3D mold making |
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Placing molded parts (thickness >0,7mm) |
| Table 1: Configuration options for polyimide paper | ||
Applications of polyimide paper
Whether as adhesive-coated heat barrier tape, aluminized polyimide paper, polyimide paper sheet (multi-layer), layer construction or 3D mold making, the application range of polyimide paper is broad and versatile.
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| Adhesive-coated heat barrier tape | Aluminized polyimide paper | Polyimide paperboard (multilayer) | Layer construction, 3D mold making |
| Table 2: Applications of polyimide paper | |||
Furthermore, polyimide paper can be ideally combined with CFRP applications. This allows for heat protection applications or circuits within the structure (polyimide paper for impedance control).
Heat protection for CFRP
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Circuit in structure
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Circuit in structure
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| Table 3: Combined technology with CFRP | ||
From the project sketch through processing to the finished serial part made of polyimide paper
As part of its product design services, Dr. Dietrich Müller GmbH offers a wide range of options and ideas to achieve improved production processes and optimal product quality. Various manufacturing processes are available for processing polyimide paper, such as cutting, die-cutting, forming, laminating, and gluing. Experienced application engineers and production specialists at Dr. Dietrich Müller GmbH are available to assist with the implementation of specific applications using polyimide paper.
In the area of prototype production, the company has state-of-the-art laser cutting machines, knife cutting machines, and waterjet cutting technology at its disposal. Furthermore, initial samples can also be produced on the CNC machining centers.
Dr. Dietrich Müller GmbH is the specialist for electrical insulating materials, thermal conductivity products, seals and technical films.
In the area of series production for the manufacture of stamped parts from polyimide paper, state-of-the-art stamping machines, rotary stamping machines, eccentric presses and hand stampers are used.
Dr. Dietrich Müller GmbH specializes in the production of polyimide paper, electrical insulating materials, thermal conductivity products, gaskets, and technical films. The product portfolio includes flexible electrical insulating materials, prepregs, coated fabrics, adhesive tapes, laminates and profiles, thermal conductivity products, technical films, sealing materials, mica products, and other product groups.
The execution of orders utilizes both materials from third-party suppliers and the company's own patented solutions. In addition to its own products, the company also offers technical services and consulting.














