Thermipad® TP 22836 – High-performance gap filler without silicone for sensitive electronics
Thermipad® TP 22836 is a silicone-free, thermally conductive gap filler material with low compression force. Designed for applications where sensitive electronic components need to be protected from mechanical stress, this material provides reliable thermal bonding without the disadvantages of silicone-based products.
With a thermal conductivity of 7,8 W / mK Thermipad® TP 22836 is one of the more powerful gap fillers on the market and is ideal for areas such as Telecommunications, automotive electronics, datacom systems and optical modules.
Advantages at a glance
- Silicone free – ideal for optical and sensitive applications
- High thermal conductivity (7,8 W/mK) – effective heat dissipation even with small thickness
- Low compression force – protects sensitive components
- conforms to UL94 V-0 – meets high flame retardant requirements
- Excellent electrical insulation – with a breakdown voltage of 7,9 kV/mm
Technical features
- Color: dark gray
- Thickness: 0,5 mm to 4 mm (in 0,5 mm increments)
- thermal conductivity: 7,8 W/mK
- Working temperature: -65 °C to +150 °C
- Thermal resistance (1,5mm, 30PSI): 0,057°C in²/W
- density: 3,4 g/cc
- Dielectric breakdown voltage: 7,9 kV/mm
- Volume resistance: 5 × 10¹³
Delivery forms
Thermipad® TP 22836 is available in thicknesses of 0,5 mm to 4 mm available. On request we can produce individual cuts or molded parts exactly according to customer specifications.
Typical areas of application
- telecommunications systems
- Automotive electronics
- Optical modules
- Datacom systems
- power Electronics
- Sensors and LED technology
Request samples or get advice now
Whether in prototype development or series production – the Thermipad® TP 22836 offers reliable performance for demanding thermal requirements. Contact us for further information or individual inquiries.
