Silicone-free thermal conductivity products: Efficient cooling – without compromising on purity and sustainability
In modern electronics, electromobility, and LED technology, efficient thermal management is crucial for the performance and longevity of devices. At the same time, demands on environmental compatibility, product cleanliness, and process reliability are increasing. Silicone-free thermal conductivity products offer the ideal solution here – especially in sensitive applications where silicone oils are problematic.
Dr. Dietrich Müller GmbH offers a comprehensive portfolio of silicone-free thermal pastes, pads, adhesive tapes, and adhesives for a wide range of applications. Below, we present the most important product groups.
Thermal pastes: Highest performance, zero silicone
The silicone-free thermal pastes is Thermigrease®series combine excellent thermal conductivity with stable mechanical properties – without any silicone evaporation or oil separation.
Examples from the range:
- TG 20032 (2,5 W/mK): Ideal for industrial applications – thermally efficient, stable, silicone-free.
- TG 20033 (3,0 W/mK): Particularly heat-resistant (up to 1200 °C!) – suitable for furnaces, aviation and high-temperature technology.
- TG 20060 – TG 20063 (1,4–7,5 W/mK): For demanding applications in e-mobility, DC/DC converters, and automotive displays. TG 20063 impresses with top values in thermal conductivity.
These pastes are easy to apply, spread evenly and provide permanent thermal contact – without the disadvantages of silicone-based alternatives.
| Product | Order no. | Description | W / mK | Workspace in °C | Applications | PDF DE | PDF EN |
|---|---|---|---|---|---|---|---|
| Thermigrease® | TG 20032 | silicone-free, pasty, white/grey Thermal paste, for increased temperature, thermal conductivity and stability requirements | 2,5 | -50 To + 208 | Best non-curing silicone-free thermal paste, good thermal conductivity requirements and stability requirements eg automotive electronics | Download | Download |
| Thermigrease® | TG 20033 | silicone-free, pasty, grey-brown/beige thermal paste, for the highest temperature requirements (up to 1200°C), hardening | 3,0 | -180 To + 1200 | Curing thermal paste, good Thermal conductivity, high temperature resistance. For high temperature applications such as furnaces, Heaters, high temperature sensors | Download | Download |
| Thermigrease® | TG 20060 | Silicone-free thermal paste, high efficiency in heat transfer | 1,4 | -30 To + 150 | Designed for applications in displays, Power supplies with DC-DC converters, engine management, Communication and multimedia systems, Vehicle control, thermal management of electric vehicles, etc. | Download | Download |
| Thermigrease® | TG 20061 | Silicone-free thermal paste, high efficiency in heat transfer | 3 | -30 To + 150 | Designed for applications in displays, Power supplies with DC-DC converters, engine management, Communication and multimedia systems, Vehicle control, thermal management of electric vehicles, etc. | Download | Download |
| Thermigrease® | TG 20062 | Silicone-free thermal paste, high efficiency in heat transfer | 3,5 | -40 To + 125 | Designed for applications in displays, Power supplies with DC-DC converters, engine management, Communication and multimedia systems, Vehicle control, thermal management of electric vehicles, etc. | Download | Download |
| Thermigrease® | TG 20063 | Silicone-free thermal paste, high efficiency in heat transfer | 7,5 | -40 To + 125 | Designed for applications in displays, Power supplies with DC-DC converters, engine management, Communication and multimedia systems, Vehicle control, thermal management of electric vehicles, etc. | Download | Download |
Thermiflex® TF 21329: Bonding & Cooling in one
The silicone-free thermal adhesive tape TF 21329 from the Thermiflex® range combined:
- Thermal conductivity (0,6 W/mK),
- Electric Isolation (Dielectric strength up to 3,75 kV),
- Secure liability even on difficult surfaces,
- Malleable acrylic structure for optimal contact surfaces.
It is used, among other things, in Mounting of LED modules, displays or CPU heatsinkswhere it not only cools but also reliably connects – without any screws, clamps or thermal paste.
| Product | Order no. | Description | Thickness in mm | W / mK | Workspace in °C | Applications | PDF DE | PDF EN |
|---|---|---|---|---|---|---|---|---|
| Thermiflex® | TF 21329 | thermally conductive adhesive tape, silicone-free, acrylic adhesive | 0,25 | 0,6 | -30 To + 100 | Bonding of LED modules and heat sinks | Download | Download |
Thermipad®: Silicone-free thermal pads for flat applications
The Thermipad® series also includes silicone-free, pre-assembled Thermal pads for mounting between circuit board and heat sink.
Relevant products such as TP 22832, TP 22836 and TP 22840 are electrically insulating, mechanically adaptable, and available in various thicknesses. They offer a clean, maintenance-free alternative to paste and are particularly suitable for series production.
| Product | Order no | Description | Thickness in mm | W / mK | Workspace in °C | Application | PDF DE | PDF EN |
|---|---|---|---|---|---|---|---|---|
| Thermipad® | TP 22832 | Silicone-free gap filler material with low compression force | 0,5 - 4,0 | 4,0 | -65 To + 150 | Sensitive electronics and optical systems where only minimal pressure may be exerted on components | Download | Download |
| Thermipad® | TP 22836 | Silicone-free gap filler material with low compression force | 0,5 - 4 | 7,8 | -65 to + 150 | Datacom systems, automotive electronics, telecommunications systems and optical modules. | Download | Download |
| Thermipad® | TP 22840 | Silicone-free gap filler material with low compression force | 0,5 - 5,0 | 10,0 | -65 to + 125 | Datacom systems, automotive electronics, telecommunications systems and optical modules. | Download | Download |
TL 23010 – the heat-conducting adhesive
The silicone-free thermally conductive adhesive TL 23010 was specially developed for the permanent connection of heat-generating components. It offers:
- Good thermal conductivity,
- Mechanical stability,
- Silicone-free to avoid outgassing or migration.
It is ideal for bonding heat sinks, power semiconductors or sensitive modules – especially in medical technology, measurement technology or aviation.
| Product | Order no | Description | W / mK | Workspace in °C | Applications | PDF DE | PDF EN |
|---|---|---|---|---|---|---|---|
| Thermiglue® | TL 23010 | Two-component thermally conductive adhesive Silicone-free epoxy resin adhesive | 2,0 | -85 To + 180 | Download | Download |
Why silicone-free?
Choosing silicone-free thermal conductive products brings decisive advantages:
- No outgassing: Prevention of silicone oil contamination in sensitive manufacturing environments (e.g. optics, cleanroom, automotive).
- Environmental compatibility: Better recyclable, often acrylate-based, silicone-free = less problematic in disposal and further processing.
- Process reliability: No embrittlement or migration over long periods of time – making it ideal for permanent applications.
- Compatibility: Safe to use with coatings, solder joints or sensitive surfaces that would be damaged by silicone.
Summary
Silicone-free thermal interface products from Dr. Dietrich Müller GmbH offer not only high thermal performance, but also the highest process purity and reliability. Whether as paste, pad, adhesive, or tape – they are the first choice for developers who don't want to compromise.
Interested in samples or advice?
The team at Dr. Dietrich Müller GmbH will be happy to assist you in selecting the right thermal interface material for your application.
