Thermipad® TP 22840 is a high-performance, silicone-free thermal pad with low compression force. It was specifically developed for applications where sensitive electronic or optical components need to be protected from mechanical stress. Thanks to its excellent thermal conductivity of 7,8 W/mK and high electrical insulation, TP 22840 is ideal for demanding applications...
Thermiflex® TF PCM 21810 is an innovative phase-change thermal interface material specifically developed for use in high-performance electronic devices. Thanks to its silicone-free formulation and excellent thermal properties, it ensures reliable heat dissipation in demanding applications. What is Thermiflex® TF PCM 21810? Thermiflex® TF PCM 21810 is based on a silicone-free substrate and...
Thermipad® TP 22832 is a high-performance, silicone-free thermal interface material specifically developed for applications where sensitive electronic components need to be protected from mechanical stress. With its low compression force and a thermal conductivity of 4,0 W/mK, it provides reliable thermal connection without exerting excessive pressure on components. Ideal solution for...
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