Thermal pad with low compression force

Thermipad® TP 22832 – Silicone-free gap filler material for sensitive electronics

Thermipad® TP 22832 is a high-performance, silicone-free thermal interface material specifically developed for applications where sensitive electronic components need to be protected from mechanical stress. With its low compression force and a thermal conductivity of 4,0 W/mK, it provides reliable thermal connection without exerting excessive pressure on components. Ideal solution for...