Thermipad® TP 22840 is a high-performance, silicone-free thermal pad with low compression force. It was specifically developed for applications where sensitive electronic or optical components need to be protected from mechanical stress. Thanks to its excellent thermal conductivity of 7,8 W/mK and high electrical insulation, TP 22840 is ideal for demanding applications...
Thermipad® TP 22836 is a silicone-free, thermally conductive gap filler material with low compression force. Designed for applications where sensitive electronic components must be protected from mechanical stress, this material provides reliable thermal bonding without the disadvantages of silicone-containing products. With a thermal conductivity of 7,8 W/mK, Thermipad® TP 22836 is one of the more powerful...
Thermipad® TP 22832 is a high-performance, silicone-free thermal interface material specifically developed for applications where sensitive electronic components need to be protected from mechanical stress. With its low compression force and a thermal conductivity of 4,0 W/mK, it provides reliable thermal connection without exerting excessive pressure on components. Ideal solution for...
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