The 30th Motek 2011 and the 5th Bond Expo
Ahlhorn | Stuttgart | 27.09.2011/XNUMX/XNUMX
The 30th MOTEK 2011 and the 5th Bondexpo will take place from October 10th to 13th at the Stuttgart exhibition center. The leading event for assembly and handling technology as well as automation is the perfect platform for specialists and suppliers from the metal and plastics processing industry in general, mechanical and plant engineering, and the electrical and electronics industry to meet.
The 30th Motek, or pure production and assembly automation, focuses on mechanical engineering and the entire world of automation Exhibition program well-known topics such as: assembly, handling, monitoring, control-integrated systems, organization, microtechnology, etc.
In addition, the program of the 5th Bondexpo informs visitors about raw materials for adhesives and sealants, Machines, devices and accessories for the adhesive manufacturing industry.
During the presentation of this trade fair for industrial bonding technology, the participants will be informed on three exciting days about central topics from the latest innovations in the fields of mechatronics, micro and nanotechnology, medical technology.
