Thermally conductive foil Thermiflex TF 21205
Properties and composition of Thermiflex TF 21205
Thermiflex TF 21205 is used in the thermal connection of e.g. B. MOSFETs, IBGTs, diodes, rectifiers and electronic modules are used. In addition, Thermiflex TF 21205 can be used e.g. B. used in inverters, power supplies, UPS devices, motor controls and in solar technology. The special formulation and filling of the silicone with ceramic fillers leads to excellent conductivity. The material adapts very well to the special surface structure. This minimizes the overall thermal contact resistance. The glass fiber reinforcement ensures high mechanical stability and easy handling. The material can be coated on one side with a pressure-sensitive adhesive (TF 21805) for easy and safe pre-assembly.
Thermiflex TF 21205 has excellent thermal conductivity and surface conformance. In addition, the material has very good thermal contact. Thermiflex TF 21205 is also characterized by high mechanical stability. Thermiflex TF 21205 is extremely resistant to aging and chemicals. Residue-free removal after application is also guaranteed.
Use of Thermiflex TF 21205
Thermiflex TF 21205 is used for the thermal connection of eg MOSFETs, IBGTs, diodes, rectifiers and electronic modules. In addition, Thermiflex TF 21205 can be used e.g. B. used in inverters, power supplies, UPS devices, motor controls and solar technology.
Data sheet Thermiflex TF 21205
You will receive the data sheet as part of specific project inquiries.
