SMT Hybrid Packaging 2013Müller Ahlhorn
Nuremberg | 11.04.2013
SMT Hybrid Packaging 2013 in Nuremberg from 16 – 18 April 2013 offers a comprehensive overview of products and services for system integration in microelectronics. Numerous small and medium-sized companies, including several first-time exhibitors, will present themselves.
Live production “Power on one line” – concentrated power from 16 technology partners and 19 exhibitors
Under the motto “Power on a line”, the Application Center at Fraunhofer IZM is once again organizing a live production. Technologically, the focus will be on the current topics in the production of power electronics and LED assemblies. Visitors will be able to follow the entire process chain in the manufacture of electronic assemblies live, from the receipt of goods to the testing of the assemblies, and will be able to receive detailed explanations during the line tours, which take place several times a day. In addition, experts from business and science will be available in the technology consultation hour to answer questions about technical products, services and topics such as subsidy advice.
Joint stand “Molded Interconnect Devices
The joint stand of the 3D-MID e.V. research association offers insights into MID technology. Trends and developments in this field will be presented both on the production line “MID: Mechatronic Integration in 3 Dimensions” and at a separate forum.
EMS in focus
This year the trade fair will again address the topic of EMS in various areas. On the one hand, visitors can obtain specific information about the products and services offered by more than 15 contract manufacturers and EMS providers at the special EMS Service Point.
On the other hand, the ZVEI will present an EMS article and present its new brochure “The World of Testing – With Safety the Desired Quality” at the trade fair forum on Thursday, 18 April 2013.
Congress with new concept
A new format was developed for the congress, which makes it easy to attend the congress and visit the trade fair in one day. For the first time, the congress will take place on Wednesday and Thursday mornings, leaving enough time in the afternoon to inform yourself about the latest products and trends at the trade fair. On Wednesday, international experts will present “Assembly technologies and packaging at wafer level – Smaller systems do not exist”, on Thursday “Robust assemblies and high-temperature contacting technologies – Resistant to unknown stresses” will be presented.
In addition, a total of 18 practice-oriented half-day tutorials are on the programme from Tuesday to Thursday. Relevant issues will be discussed – the spectrum covers the entire value-added chain of electronic assembly production from design and process technology to quality assurance. Last year’s success will be followed up by the continuation of the English-language “Printed Electronics” workshop. On Tuesday, “Additive Manufacturing – 2D and 3D printing for electronics manufacturing” will be discussed in greater detail.
Numerous networking opportunities at SMT Hybrid Packaging 2013
Europe’s leading event for system integration in microelectronics is this year’s motto “networking”. 517 exhibitors will present the latest trends, products and services in Nürnberg from 16-18.04.2013. On a total area of 27,000 square metres, the
SMT Hybrid Packaging 2013 offers numerous networking opportunities for suppliers and customers.
Trade fair shows optimized production
A highlight of the trade fair is the production line organized by the Application Center at Fraunhofer IZM in Hall 6, Stand 6-434, which demonstrates the perfect interaction between development and production. Under the theme “Power on the line – Concentrated power from 15 technology partners”, leading technology and machine suppliers will show how power electronic assemblies can be manufactured economically and using modern machines and technologies. The line tours, which take place three times a day, are supplemented by technology consultation hours, during which the machine suppliers and the research and technology partners are available to visitors for questions relating to everyday business.
Current status of MID technology
21 companies and institutes will provide information on the current state of MID technology and new series applications at the joint stand of the 3-D MID network in Hall 7, Stand 7-810. For the first time, there will also be a MID forum at booth 7-604, where the companies participating in the joint booth will present current trends and developments.
Joint stands “Service Point EMS
The joint stands “Service Point EMS” (Hall 9, Stand
9-304) and “Optics meets Electronics” (Hall 6, Stand 6-115) focus on the topics of electronic manufacturing services and optoelectronics and enable direct comparison of suppliers in these areas. As in previous years, two further forums will also contribute to the networking of knowledge at SMT Hybrid Packaging 2013 with panel discussions, expert forums (Hall 9, Stand 9-340) and product presentations (Hall 9, Stand 9-424).
Congress with new concept
Parallel to the trade fair, the top-class congress offers the opportunity for dialogue between science and industry. The new congress format with two half-day sessions on Wednesday and Thursday mornings allows a targeted participation with efficient trade fair attendance on one day. On Wednesday, international experts will present “Packaging and packaging technologies at wafer level – Smaller systems don’t exist”, on Thursday there will be a lecture on “Robust assemblies and high temperature contacting technologies – Resistant to unknown stresses”.
Proven tutorials and workshop
In addition, a user-oriented tutorial and workshop program provides answers to daily questions in electronics production. Relevant questions are discussed – the spectrum covers the entire value chain of electronic assembly production from design to process technology and quality assurance. Last year’s success will be followed up by the continuation of the workshop on “Printed Electronics”. On Tuesday, “Additive Manufacturing – 2D and 3D printing for electronics manu