The 30th MOTEK 2011 and the 5. Bondexpo

The 30th Motek 2011 and the 5th Bond Expo

The 30th MOTEK 2011 and the 5. Bondexpo

Ahlhorn | Stuttgart | 09/27/2011

The 30th MOTEK 2011 and the 5. Bondexpo, take place from 10. until 13. October at the Landesmesse Stuttgart.

automation, is the perfect platform for specialists and suppliers from the following sectors: metal and plastics processing, electrical and electronics industries as well as solar, automotive, mechanical and plant engineering.

The 30th Motek, or Industrial Handling, focuses on mechanical engineering and the whole world of automation. This year it offers remarkable topics in its exhibition program such as: assembly, handling, joining, control, integrated systems, microtechnology, etc.

In addition, the 5th Bondexpo offers its visitors an exhibition program with raw materials for adhesives and sealants, machines, systems and accessories for the adhesive manufacturing industry.

At the trade fair for bonding, insulating, potting and foaming, the participants are informed about important topics from the latest innovations in the areas of mechatronic developments, micro and nanotechnology and medical technology through exciting activities.

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