The 30th Motek 2011 and the 5th Bond ExpoMüller Ahlhorn
Ahlhorn | Stuttgart | 27.09.2011
The 30. MOTEK 2011 and the 5th Bondexpo, will be held from the 10th to the 13th of October at the Stuttgart Exhibition Centre. This leading event for Assembly and Handling Technology, and Automation, is the perfect platform where the professionals and suppliers from the metal and plastic processing industries in general, the machinery and equipment manufacturing as well as the electrical and electronics industries assemble.
The 30. Motek or pure production and assembly automation, focused on mechanical engineering and the entire world of automation, this year in its exhibition program includes notable topics covering: Assembly, Handling, Monitoring, Control Integrated Systems, Organizing, Micro Technology, etc.
In addition to, the 5th Bondexpo´s program provides visitors with information on raw materials for adhesives and sealants, machinery, equipment and accessories for the adhesives manufacturing industry concerning among others.
During the display of this Trade Fair for Industrial Bonding Technology the participants will be updated on key issues from the latest innovations in the fields of the mechatronics, micro and nano technology , medical technology across three days of exciting activities.